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r08ds0017ej0001 rev.0.01 page 1 of 11 aug 20, 2010 preliminary data sheet specifications in this document ar e tentative and subject to change. ps9306l,ps9306l2 ? nepoc series ? 0.6 a output current, high cmr, igbt gate drive, 6-pin sdip photocoupler description the ps9306l and ps9306l2 are optical coupled isolators containing a gaalas led on the input side and a photo diode, a signal processing circuit and a power output transistor on the output side on one chip. the ps9306l and ps9306l2 are in 6-pi n plastic sdip (shrink dual in-line package). the ps9306l2 has 8 mm creepage distance. the mount area of 6-pin plastic sdip is half size of 8-pin dip. the ps9306l and ps9306l2 are designed specifically for high common mode transient immunity (cmr) and high switching speed. it is suitable for driving igbts and mos fets. the ps9306l is lead bending type (gull-wing) for surface mounting. the ps9306l2 is lead bending type for long cr eepage distance (gull-wing) for surface mount. features ? long creepage distance (8 mm min.: ps9306l2) ? half size of 8-pin dip ? peak output current (0.6 a max., 0.4 a min.) ? high speed switching (t plh , t phl = 0.4 s max.) ? high common mode transient immunity (cm h , cm l = 25 kv/ s min.) ? embossed tape product : ps9306l-e3 : 2 000 pcs/reel : ps9306l2-e3: 2 000 pcs/reel ? pb-free product applications ? igbt, power mos fet gate driver ? industrial inverter ? ih (induction heating) r08ds0017ej0001 rev.0.01 a ug 20, 2010 1. anode 2. nc 3. cathode 4. v ee 5. v o 6. v cc 64 13 2 5 pin connection (top view) shield
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 2 of 11 aug 20, 2010 package dimensions (unit: mm) lead bending type (gull-wing) for surface mount 0.250.15 9.70.3 3.70.25 0.80.25 0.20.15 7.62 3.50.2 6.80.25 4.580.3 (0.82) ps9306l 0.40.1 0.25 m 1.27 lead bending type (gull-wing) for long creepage distance (surface mount) 0.20.15 ps9306l2 11.50.3 6.80.25 4.580.3 0.250.15 0.750.25 (0.82) 3.70.25 3.50.2 7.62 0.40.1 0.25 m 1.27
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 3 of 11 aug 20, 2010 photocoupler construction parameter ps9306l ps9306l2 air distance (min.) 7 mm 8 mm outer creepage distance (min.) 7 mm 8 mm isolation distance (min.) 0.4 mm 0.4 mm marking example rank code year assembled (last 1 digit) week assembled n 0 31 9306 n031 no. 1 pin mark assembly lot type number company logo *1 note: *1 nec company logo is planned to be changed to "r" indicator after october 2010.
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 4 of 11 aug 20, 2010 ordering information part number order number solder plating specification packing style safety standard approval application part number *1 ps9306l ps9306l-ax pb-free 20 pcs (tape 20 pcs cut) standard ps9306l ps9306l-e3 ps9306l-e3-ax (ni/pd/au) embossed tape 2 000 products pcs/reel (ul and csa ps9306l2 PS9306L2-AX 20 pcs (tape 20 pcs cut) awaiting approval) ps9306l2 ps9306l2-e3 ps9306l2-e3-ax embossed tape 2 000 pcs/reel ps9306l-v ps9306l-v-ax 20 pcs (tape 20 pcs cut) din en60747-5-2 ps9306l ps9306l-v-e3 ps9306l-v-e3-ax embossed tape 2 000 (vde0884 part2) pcs/reel awaiting approval (option) ps9306l2-v ps9306l2-v-ax 20 pcs (tape 20 pcs cut) ps9306l2 ps9306l2-v-e3 ps9306l2-v-e3-ax embossed tape 2 000 pcs/reel note: *1. for the application of the safety standard, following part number should be used.
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 5 of 11 aug 20, 2010 absolute maximum ratings (t a = 25 c, unless otherwise specified) parameter symbol ratings unit diode forward current i f 25 ma peak transient forward current (pulse width < 1 s) i f (tran) 1.0 a reverse voltage v r 5 v power dissipation *1 p d 45 mw detector high level peak output current *2 i oh (peak) 0.6 a low level peak output current *2 i ol (peak) 0.6 a supply voltage (v cc ? v ee ) 0 to 35 v output voltage v o 0 to v cc v power dissipation *3 p c 250 mw isolation voltage *4 bv 5 000 vr.m.s. operating frequency *5 f 50 khz operating ambient temperature t a ? 40 to +110 c storage temperature t stg ? 55 to +125 c notes: *1. reduced to 1.2 mw/ c at t a = 85 c or more. *2. maximum pulse width = 10 s, maximum duty cycle = 0.2% *3. reduced to 4.5 mw/ c at t a = 65 c or more. *4. ac voltage for 1 minute at t a = 25 c, rh = 60% between input and output. pins 1-3 shorted together, 4-6 shorted together. *5. i oh (peak) 0.4 a ( 2.0 s), i ol (peak) 0.4 a ( 2.0 s) recommended operating conditions parameter symbol min. typ. max. unit supply voltage (v cc ? v ee ) 10 30 v forward current (on) i f (on) 8 12 ma forward voltage (off) v f (off) ? 2 0.8 v operating ambient temperature t a ? 40 110 c
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 6 of 11 aug 20, 2010 electrical characteristics (t a = ? 40 to +110 c, v cc = 10 to 30 v, i f (on) = 8 to 12 ma, v f (off) = ? 2 to 0.8 v, v ee = gnd, unless otherwise specified) parameter symbol conditions min. typ. *1 max. unit diode forward voltage v f i f = 10 ma, t a = 25 c 1.2 1.56 1.8 v reverse current i r v r = 3 v, t a = 25 c 10 a input capacitance c in f = 1 mhz, v f = 0 v, t a = 25 c 30 pf detector high level output current i oh v o = (v cc ? 4 v) *2 0.2 a v o = (v cc ? 10 v) *3 0.4 0.5 low level output current i ol v o = (v ee +2.5 v) *2 0.2 0.4 a v o = (v ee +10 v) *3 0.4 0.5 high level output voltage v oh i o = ? 100 ma *4 v cc ? 4.0 v cc ? 1.8 v low level output voltage v ol i o = 100 ma 0.4 1.0 v high level supply current i cch i o = 0 ma 0.7 3.0 ma low level supply current i ccl i o = 0 ma 1.2 3.0 ma coupled threshold input current (l h) i flh i o = 0 ma, v o > 5 v 7.0 ma threshold input voltage (h l) v fhl i o = 0 ma, v o < 5 v 0.8 v isolation capacitance c i-o v f = 0 v, f = 1 mhz, t a = 25 c 0.7 pf notes: *1. typical values at t a = 25 c, v cc ? v ee = 30 v. *2. maximum pulse width = 50 s, maximum duty cycle = 0.5%. *3. maximum pulse width = 10 s, maximum duty cycle = 0.2%. *4. v oh is measured with the dc load current in this testing.
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 7 of 11 aug 20, 2010 switching characteristics (t a = ? 40 to +110 c, v cc = 10 to 30 v, i f (on) = 8 to 12 ma, v f (off) = ? 2 to 0.8 v, v ee = gnd, unless otherwise specified) parameter symbol conditions min. typ. *1 max. unit propagation delay time (l h) t plh r g = 47 , c g = 3 nf, 0.05 0.18 0.4 s propagation delay time (h l) t phl f = 10 khz, 0.05 0.18 0.4 s pulse width distortion (pwd) |t phl ? t plh | duty cycle = 50% *2 , 0.25 s propagation delay time (difference between any two products) t phl ? t plh i f = 10 ma, v cc = 30 v ? 0.3 0.3 s rise time t r 50 ns fall time t f 50 ns common mode transient immunity at high level output |cm h | t a = 25 c, i f = 10 ma, v cc = 30 v, v cm = 1.5 kv, v o (min.) = 26 v 25 kv/ s common mode transient immunity at low level output |cm l | t a = 25 c, i f = 0 ma, v cc = 30 v, v cm = 1.5 kv, v o (max.) = 1 v 25 kv/ s notes: *1. typical values at t a = 25 c, v cc ? v ee = 30 v. *2. this load condition is equivale nt to the igbt load at 1 200 v/25 a.
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 8 of 11 aug 20, 2010 test circuit i f = v cc = 0.1 f 4 v i oh 8 to 12 ma 10 to 30 v v o > 5 v i f shield 6 1 2 3 5 4 v cc = 0.1 f 10 to 30 v shield 6 1 2 3 5 4 i f = v cc = 0.1 f 100 ma v oh 8 to 12 ma 10 to 30 v shield 6 1 2 3 5 4 100 ma v cc = 0.1 f 2.5 v 10 to 30 v shield 6 1 2 3 5 4 i ol v cc = 0.1 f 10 to 30 v shield 6 1 2 3 5 4 v ol fig. 1 i oh test circuit fig. 3 v oh test circuit fig. 5 i flh test circuit fig. 4 v ol test circuit fig. 2 i ol test circuit
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 9 of 11 aug 20, 2010 47 3 nf i f = 10 ma 10 khz 50% duty cycle t phl t plh i f v out 90% 50% 10% t r t f i f a b v cm = 1.5 kv cm h cm l 1 v 26 v v o v o 1 500 v v cm v o t r t f 90% 10% v o v cc = 0.1 f 10 to 30 v shield 6 1 2 3 5 4 v o v cc = 30 v 0.1 f shield 6 1 2 3 5 4 fig. 6 t plh , t phl , t r , t f test circuit and wave forms fig. 7 cmr test circuit and wave forms (switch a: i f = 10 ma) (switch b: i f = 0 ma) remarks 1. common mode transient immunity at high level output is the maximum value of dv cm /dt at which the output remains high level (e.g. v o > 26 v). 2. common mode transient immunity at low level output is the maximum value of dv cm /dt at which the output remains low level (e.g. v o < 1.0 v). 3. connect pin 2 to the led common.
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 10 of 11 aug 20, 2010 notes on handling cautions regarding noise be aware that when voltage is applied suddenly between the photocoupler?s input and output at startup, the output transistor may enter the on state, even if the voltage is within the absolute maximum ratings. usage cautions 1. this product is weak for static electricity by designed w ith high-speed integrated circuit so protect against static electricity when handling. 2. board designing (1) by-pass capacitor of more than 0.1 f is used between v cc and gnd near device. also, ensure that the distance between the leads of the photocoupler and capacitor is no more than 10 mm. (2) in older to avoid malfunctions and characteristics degradation, igbt coll ector or emitter traces should not be closed to the led input. (3) pin 2 (which is an nc *1 pin) can either be connected directly to the gnd pin on the led side or left open. unconnected pins should not be used as a bypass for signals or for any other similar purpose because this may degrade the internal noise environment of the device. note: *1. nc: non-connection (no connection). 3. make sure the rise/fall time of the forward current is 0.5 s or less. 4. in order to avoid malfunctions, make sure the rise/fall slope of the supply voltage is 3 v/ s or less. 5. avoid storage at a high te mperature and high humidity.
preliminary document specifications in this document are tentative and subject to change. ps9306l,ps9306l2 chapter title r08ds0017ej0001 rev.0.01 page 11 of 11 aug 20, 2010 caution gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposi ng of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, tran sport and dispose of materials that contain arsenic and ot her such industrial waste materials. 2. exclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subjec t to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the product. ? do not lick the product or in any way allow it to enter the mouth.
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history ps9306l,ps9306l2 preliminary data sheet description rev. date page summary 0.01 aug 20, 2010 ? first edition issued
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